The AMBRB30200CT is a 30 A, 200 V common-cathode Schottky dual diode in a D2PAK package from Good-Ark, with 0.84 V typical forward drop per die at 15 A and a 200 A per-die surge rating. It targets the 200 V-class secondary side of OBC and server DC-DC stages, where the reflected voltage fits with margin and the board carries the heat.
AMBRB30200CT at a Glance
All values below come from the official Good-Ark datasheet:
| Parameter | Symbol | Value |
|---|---|---|
| Maximum repetitive peak reverse voltage | VRRM | 200 V |
| Maximum RMS / DC blocking voltage | VRMS / VDC | 140 / 200 V |
| Average forward current | IF(AV) | 30 A |
| Peak forward surge current (8.3 ms, per die) | IFSM | 200 A |
| Forward voltage, IF = 15 A, TJ = 25 °C | VF | 0.84 typ / 1.00 max V |
| Forward voltage, IF = 15 A, TJ = 125 °C | VF | 0.92 max V |
| Reverse leakage, TJ = 25 °C / 100 °C | IR | 200 µA max / 15 mA max |
| Thermal resistance | RθJC / RθJA | 2.0 / 62.5 °C/W |
| Package | — | TO-263 (D2PAK), dual common cathode |
Note: the product page title displays AMBRB30200C; the datasheet part marking is AMBRB30200CT—confirm the exact marking with the supplier before ordering.
The dual construction reads the same way as its 45 V sibling: the 30 A rating is the package total, each die carries its share, and the per-die VF figures at 15 A are the numbers the loss budget uses. The package is one thermal load, and the two die share the same exposed pad.
The 200 V Class for OBC DC-DC Secondaries
The OBC DC-DC secondary rectifies the transformer output with the reflected voltage setting the reverse stress. A 200 V class covers the typical reflected peaks of a 200 V-class secondary with the 20–30% margin from the voltage rating rule; the class sits below the 250 V rung, so it also costs less forward drop than a 250 V part at the same current. The boundary between the 200 V and 250 V rungs follows the measured reflected peak, and the OBC system design is covered in its own article.
The 200 V class also sits above the 100 V rung, which matters for the leakage side of the budget: the higher class carries a higher forward drop at the same current, and the leakage power at the working reverse voltage belongs in the thermal math. The class is chosen for the reflected peak with margin, and the leakage term is the price of that margin.
D2PAK Thermal Design for Continuous 30 A
Continuous 30 A is a thermal statement: at 15 A per die with the 0.84 V typical drop, each die dissipates roughly 12.6 W as a first pass, and the 2.0 °C/W junction-to-case resistance turns that into about 25 °C of case-to-junction rise per die. The final budget uses the maximum VF at the operating temperature, adds the leakage term at the working reverse voltage, and walks the full board thermal path—pad, vias, copper, enclosure—confirmed on the prototype. The D2PAK design guide covers the pad and via rules that make the rating achievable.
The board is the heatsink, and its quality decides whether the 25 °C rise stays a calculation or becomes a measurement: a copper pad matching the exposed pad, a via grid into inner planes, and a void-controlled joint are the three variables, and the case-temperature reading on the first build is the verdict.
Paralleling for Higher Current
When the secondary needs more than 30 A, multiple AMBRB30200CT devices can be paralleled, with symmetric layout, equal trace resistance, and a common thermal area so the current and temperature share evenly. The paralleling guide covers the method; the part-level point is that the 200 V class and D2PAK footprint make a two- or three-device parallel bank a practical board design.
The parallel bank also spreads the surge duty and the thermal load, which is why a 60 A secondary is often two 30 A devices rather than one oversized part: the per-device loss stays manageable, the board copper is used symmetrically, and a failure in one path is contained. The sharing measurement on the prototype confirms the design.
Official Documentation and Samples
The AMBRB30200CT product page hosts the datasheet, and the Schottky rectifier diodes category shows the wider family. Contact Good-Ark with your secondary voltage, current, and board design to confirm documentation and request samples.
The OBC program’s documentation set—datasheet, qualification status, and the marking confirmation—is requested together, so the supply chain and the engineering team read the same revision.
Frequently Asked Questions
What is the forward drop of the AMBRB30200CT?
0.84 V typical and 1.00 V maximum per die at 15 A and 25 °C, with 0.92 V maximum at 125 °C. Use the maximum at the operating temperature for the budget.
Why 200 V instead of 250 V for the secondary?
The 200 V class covers the reflected peaks with margin and costs less forward drop than the 250 V rung at the same current. The class follows the measured reflected peak.
How much heat does 30 A create?
At 15 A per die with the typical drop, about 12.6 W per die as a first pass, about 25 °C of rise with the 2.0 °C/W path. The final budget iterates to the hot condition and confirms on the prototype.
Can I parallel two devices for 60 A?
Yes, with symmetric layout, equal trace resistance, and a shared thermal area. The paralleling guide covers the sharing method.
Why is the page title different from the part number?
The product page displays AMBRB30200C while the datasheet marking is AMBRB30200CT; confirm the exact marking with the supplier before ordering.
Specifications, Applications, Ordering
Specifications:
30 A / 200 V common-cathode Schottky in D2PAK; VF 0.84 typ / 1.00 max V at 15 A; IFSM 200 A per die; IR 200 µA max at 25 °C; RθJC 2.0 °C/W.
Applications:
OBC and server DC-DC secondaries at the 200 V class, soft-switched LLC outputs, and parallel banks above 30 A.
Ordering:
the datasheet is on the AMBRB30200CT product page; request samples and documentation through Good-Ark sales with your secondary voltage and current.